HTC - 2000

Second Announcement

HIGH TEMPERATURE CAPILLARITY

Third International Conference

Kurashiki, Japan
19-22 November, 2000

Conference Program (HTML) (PDF)

Capillary phenomena are crucially important in many forms of materials processing and fabrication. This conference focuses on their role in the development of high temperature materials, and aims to bring together the experience accumulated separately in Eastern and Western countries.
The main subjects to be addressed will be:

Capillary properties of high temperature melt:

• Liquid surfaces of metals, glasses and salts: surface energy and adsorption
• Metal-metal, metal-ceramic, metal-glass, glass-ceramic interfaces: wettability, adhesion, interfacial reactions and chemistry
• Capillarity in solidification and crystal growth phenomena
• Capillarity in microgravity-Marangoni flows
• Capillarity in corrosion and embrittlement of solids by liquid metals

Capillarity in processing of materials:

• Powder metallurgy processes
• Foundry processes and metallurgical production
• Processing of composite materials

Capillarity in joining:

• Role of surface and interface properties in metal-ceramic, metal-glass, metal-diamond and metal-metal joining by brazing and welding

*Joining and Welding Research Institute,
  Osaka University, JAPAN

*High Temperature Society, Japan
*Iron and Steel Institute, Japan
*Japan Institute of Metals
*Japan Welding Society
*Japan Institute of Light Metals
*Japan Society of Microgravity Application

*Ministry of Education, Science, Culture and Sports in Japan (tentative)
*Hosokawa Powder Foundation, Japan
*Kurashiki City, Japan
*Joining and Welding Research Institute, Osaka University

The conference will be held in Kurashiki, a historical and beautiful city. Many people like to visit Kurashiki especially in fall season. Kurashiki is located within 2hrs. from Kyoto, Osaka and also Kansai International Airport by train and ferry boat.

Extended abstracts will be used to select the contributions to be presented at the conference. Authors are invited to submit the camera-ready copy of abstracts of up to two pages including references and at least one figure. They should to be typed using a single spacing on A4 paper (210 * 297) with a 4cm header, a 4cm left margin and a 3cm footer. The paper title should be all in capital letters preferably with 14point-font boldface. Please underline the name of presenter. A 10point Helvetica, 12point Times Roman or 12point Letter Gothic typeface is recommended. SI units would be used. Good print quality is required. The abstracts should be received before the 15 of March 2000 by:Prof. K. Nogi, Joining and Welding Research Institute, Osaka Univ.,11-1 Mihogaoka, Ibaraki, Osaka, 567-0047 JAPAN

Presentations will be as talks (20 minutes including discussion) or posters. The organizers will decide on the mode of presentation, but authors are invited to indicate their preference when mailing their abstract. A number of invited papers will highlight the following areas (tentative): wetting of grain boundaries (E.Rabkin), capillarity in sintering (C.Allibert), solid state wetting (P.Wynblatt), ab-initio calculations for metal-oxide interfaces (C.Elsaesser), interface chemistry and structure (M. Ruehle), interface and joining (A.Bellosi), in-situ processing of metal -matrix composites (L.Froyen), wetting of aqueous solution on high energy surface (J.Joud), infiltration of metals in porous solids (E.Louis) and others.

The papers accepted for presentation at the Conference will be submitted to a refereeing procedure before being published in the proceedings. The original manuscript and figures used in the paper plus one photocopy should be brought to the publication desk during the first day of the Conference. The manuscript must be prepared according to the instructions that will be sent with the notification of acceptance.

English will be used for all presentations and printed materials.

* double occupancy in double bed room
** single occupancy in double bed room
person who will get financial support will be requested to stay with another person.

· Conference fee covers a copy of the conference materials (Abstract Book, Proceedings etc.), accommodation (from 19 Nov. to 22 Nov.) boarding (from dinner on 19 Nov. to lunch on 22 Nov. included official dinner) and a conference tour.
  All asked amounts do not include the bank transfer fee, which is to be covered by the participant.

Additional fees:
Accommodation (bed and breakfast): 140 USD
Extra copy of HTC-2000 Proceedings including mailing: 100 USD
Copy of HTC-97 Proceedings including mailing: 100 USD

An excursion to Awaji Island through the longest bridge in the world will be held when a number of participants are more than 5. Fee will be 50 USD including every thing.

HOW TO GET TO THE
CONFERENCE PLACE

Hotel HEISA Kurashiki:
3-21-19 Achi Kurashiki-shi Okayama-ken Japan
Tel: (81) 86-423-2400
Fax: (81) 86-423-2401
From the train station one may get to the
Hotel HEISA Kurashiki
by taxi (4�`5 USD)

Prof. Kiyoshi NOGI, Joining and Welding Research Institute,
Osaka Univ., 11-1 Mihogaoka, Ibaraki, Osaka, JAPAN
Fax & Tel: (81) 6 - 6879 - 8643
E-mail: nogisan@jwri.osaka-u.ac.jp

Third International Conference
HTC 2000

HIGH TEMPERATURE CAPILLARITY
19-22 November, 2000
KURASHIKI, JAPAN

PRE-REGISTRATION FORM

BLOCK LETTERS THROUGHOUT PLEASE

Surname...................................................................

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Title (Prof./Dr./Mr./Ms, etc.)............................................

Business Position.........................................................

Organization..............................................................

Full address..............................................................

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Telephone (please quote area).............................................

Fax number................................................................

E-mail....................................................................

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• Oral
• Poster
• Either

• Post Conference Tour
• order of extra copy of Proceedings (approx. 100USD)

• Proceedings of HTC-94 (approx. 100USD)
• Proceedings of HTC-97 (approx. 100USD)

Please complete and return to:

Prof. Kiyoshi Nogi, Joining and Welding Research Institute Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka, 567-0047 JAPAN

Fax: (81) 6-6879-8643

E-mail: nogisan@jwri.osaka-u.ac.jp