Patents (pending, obtained)
NOTICE: In case of plural holders per one patent, only members of JWRI are addressed.
The default is output from the same day of 5years ago.
 |
| Nation | Patent Number | Title | Holder Name |
| Europe | EP 2 064 731 B1 | Method of Manufacturing Semiconductor Devices | MAEDA MASAKATSU
|
| U.S.A. | US7,879,705 B2 | Semiconductor Devices and Manufacturing Method Thereof | MAEDA MASAKATSU
|
| Europe | EP 2 064 731 B1 | Method of Manufacturing Semiconductor Devices | TAKAHASHI YASUO
|
| U.S.A. | US7,879,705 B2 | Semiconductor Devices and Manufacturing Method Thereof | TAKAHASHI YASUO
|
| U.S.A. | US 8,008,180 B2 | Method of Forming an Ohmic Contact on a P-Type 4H-SiC Substrate | MAEDA MASAKATSU
TAKAHASHI YASUO
|
| U.S.A. | 12/281,966 | Transformable Metal Surface Hardening Method | FUJII HIDETOSHI
|
| U.S.A. | 12/282,052 | Joining Method | FUJII HIDETOSHI
|
| Canada | G20060144(CA) | Joining Method | FUJII HIDETOSHI
|
| Europe | EP0816414.7 | Method of Joining Metal Material | FUJII HIDETOSHI
NAKATA KAZUHIRO
|
| U.S.A. | 12/282,510 | Process for Working Metal Material and Structures | FUJII HIDETOSHI
|
| U.S.A. | 12/282,509 | Method of Joining Metal Material | FUJII HIDETOSHI
NAKATA KAZUHIRO
|
| Europe | EP7737943.6 | Wlding Method | FUJII HIDETOSHI
|
| Europe | EP0817128.2 | Process for Working Metal Material and Structures | FUJII HIDETOSHI
|
| Europe | EP7706721.3 | Method of Metal Surface Hardning Treatment Including Transformation | FUJII HIDETOSHI
|
| U.S.A. | 12/282510 | Process for Working Metal Material and Structures | FUJII HIDETOSHI
|
| Europe | US 8,038,047B2 | Method for Welding Metal Material | FUJII HIDETOSHI
|
| U.S.A. | US 7,686,238 B2 | Powder Processing Method | ABE HIROYA
NAITO MAKIO
|
| U.S.A. | US 7,905,434 B2 | Powder Processing Apparatus | ABE HIROYA
NAITO MAKIO
|
