Research Achievement Search

Category
Search date  /   /   -   /   / 
Format(yyyy/mm/dd). The default is output from the same day of last year.
Research Area
Author
Please push the "Search" button to display search results

[Manufacturing Process] include Division

Journal Publication

Title Research achievements summary Name
Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O3 Treatment   Journal of Electronic Materials,47,10(2018),5952-5958 Weixin Fu
Tatsushi Kaneda
Akiko Okada
Kaori Matsunaga
Shuichi Shoji
Mikiko Saito
Hiroshi Nishikawa
Jun Mizuno
Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition   Metals,8,8(2018),586:1-586:11 Junghwan Bang
Dong-Yurl Yu
Ming Yang
Yong-Ho Ko
Jeong-Won Yoon
Hiroshi Nishikawa
Chang-Woo Lee
Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium   Journal of Alloys and Compounds,762,(2018),586-597 C.A. Yang
S. Yang
X. Liu
H. Nishikawa
C.R. Kao
Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging   Journal of Alloy and Compounds,765,(2018),1243-1252 Shiqi Zhou
Omid Mokhtari
Muhammad Ghufan Rafique
Vasanth C. Shunmugasamy
Bilal Mansoor
Hiroshi Nishikawa
Materials Merging Mechanism of Microfluidic Electroless Interconnection Process   Journal of The Electrochemical Society,165,7(2018),D273-D281 S. Yang
H. T. Hung
P. Y. Wu
Y. W. Wang
H. Nishikawa
C. R. Kao
Corrosion and leaching behaviours of Sn-0.7Cu-0.05Ni lead-free solder in 3.5 wt. % NaCl solution   International Journal of Corrosion,2018,(2018),ID6580750 Jan-Ervin Guerrero
Omid Mokhtari
Hiroshi Nishikawa
Drexel Camacho
Effect of surface potential distribution on corrosion behavior of SnAgCu solder/Cu substrate interface   Solid State Phenomena,273,(2018),77-82 Omid Mokhtari
Hiroshi Nishikawa
Microstructural characterization of Ni-based self-fluxing alloy after selective surface-engineering using diode laser   Applied Surface Science,442,(2018),726-735 Eun-Joon Chun
Changkyoo Park
Hiroshi Nishikawa
Min-Su Kim
Laser-assisted selective fusing of thermal sprayed Ni-based self-fluxing alloys by using high-power diode lasers   Optics and Laser Technology,100,(2018),317-324 Eun-Joon Chun
Min-Su Kim
Hiroshi Nishikawa
Changkyoo Park
Jeong Suh
Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging   Journal of Materials Science: Materials in Electronic,29,5(2018),3800-3807 Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Mutsuo Saito
Transient liquid phase bonding of magnesium alloy AZ31 using Cu coatings and Cu coatings with Sn interlayers   Metals,8,1(2018),60-1-60-10 Abdulaziz Nasser Alhazaa
Muhammad Ali Shar
Anas Mahmound Atieh
Hiroshi Nishikawa
Characterization of moderately halotolerant selenate- and tellurite- reducing bacteria isolated from brackish areas in Osaka   Bioscience, Biotechnology, and Biochemistry,82,1(2018),173-181 Satoshi Soda
Wenbo Ma
Masashi Kuroda
Hiroshi Nishikawa
Yuanyuan Zhang
Michihiko Ike
Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint   Journal of Alloys and Compounds,728,(2017),992-1001 Junghwan Bang
Dong-Yurl Yu
Yong-Ho Ko
Min-Su Kim
Hiroshi Nishikawa
Chang-Woo Lee
Transmission electron microscopy investigation on the oxidation behavior of electroless Ni/immersion Au surface finish at 250 ℃   Journal of Nanoscience and Nanotechnology,17,11(2017),8522-8527 Min-Su Kim
Hiroshi Nishikawa

Proceedings of International Conference

Title Research achievements summary Name
Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying Proc. of 7th Electronics System-Integration Technology Conference,,(2018),MAT1-1:1-MAT1-1:4 Mikiko Saito
Jun Mizuno
Shunichi Koga
Hiroshi Nishikawa
Interfacial Reaction of Sn-Ag-Cu-Ni Solder/Cu Joints by Laser Process Proc. of 7th Electronics System-Integration Technology Conference,,(2018),INTS2A-4:1-INTS2A-4:4 Hiroshi Nishikawa
Ryo Matsunobu
Textile-Integrated Stretchable Structures for Wearable Wireless Platforms Proc. of 7th Electronics System-Integration Technology Conference,,(2018),INTS3A-6:1-INTS3A-6:4 Han He
Xiaochen Chen
Omid Mokhtari
Hiroshi Nishikawa
Leena Ukkonen
Johanna Virkki
Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process Proc. of 2018 IEEE 68th Electronic Components and Technology Conference,,(2018),308-313 Sean Yang
Han-Tan Hung
Hiroshi Nishikawa
C. Robert Kao
High Reliability Sintered Silver-Indium Bonding with Anti-Oxidation Property for High Temperature Application Proc. of 2018 IEEE 70th Electronic Components and Technology Conference,,(2018),1993-1999 Chun An Yang
C. Robert Kao
Hiroshi Nishikawa
Chin C. Lee
Improvement of Mechanical Properties of Zn-Added Sn58Bi Alloy by Zn Segregation on the Sn-Bi Phase Boundaries During Thermal Aging Proc. of 2018 IEEE 69th Electronic Components and Technology Conference,,(2018),1899-1905 Shiqi Zhou
Omid Mokhtari
Hiroshi Nishikawa
Mechanical Properties of Sn-Bi-In-Ga Low Melting Temperature Solder Alloys Proc. of 2018 International Conference on Electronics Packaging and IMAPS ALL Asia Conference (ICEP-IAAAC 2018),,(2018),409-410 Chih-han Yang
Shiqi Zhou
Hiroshi Nishikawa
Shih-kang Lin
Effect of indium on deformation of binary In-Bi alloys Proc. of 19th Electronics Packaging Technology Conference,,(2017),181:1-181:5 Sanghun Jin
Min-su Kim
Shutetsu Kanayama
Hiroshi Nishikawa
Impact strength of Sn-Ag-Cu/Cu solder bumps formed by an induction heating method Proc. of the 12th International Microsystems, Packaging, Assembly and Circuits Technology,,(2017),159-162 Yujian Zhang
Siliang He
Hiroshi Nishikawa
Suppression of void formation at the interface in laser soldering Proc. of the 12th International Microsystems, Packaging, Assembly and Circuits Technology,,(2017),338-341 Ryo matsunobu
Hiroshi nishikawa

Lecture

Title Research achievements summary Name
Recent Trends in Micro-joining Process for Electronics Monthly Seminar Talk at Abdullah Institute for Nanotechnology,Riyadh, Saudi Arabia,(2017.12.13) Hiroshi Nishikawa
New bonding process using maicroscale particles for die-attach in power devices 18th International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA 2017),Taipei, Taiwan,(2017.11.05-2017.11.09) Hiroshi Nishikawa

Commentary

Title Research achievements summary Name
Lead-free high temperature bonding processes for next generation power module packaging Journal of Smart Processing -for Materials, Environment & Energy-,7,1(2018),28-31 Min-Su KIM
Hiroshi NISHIKAWA

Award

Title Sponsor Name
67th ECTC Best Interactive Session Paper IEEE Electronics Packaging Society Hiroshi Nishikawa
 
Copyright© Joining and Welding Research Institute Osaka University. All Rights Reserved.