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Journal Publication

Title Research achievements summary Name
Interfacial reaction behavior and mechanical properties of pure aluminum and magnesium alloy dissimilar materials fabricated by hot press and heat treatment   Materials Characterization,157,(2019),109879 Junko Umeda
Katsuyoshi Kondoh
Hiroyuki Sannomiya
Tachai Luangvaranunt
Makoto Takahashi
Hiroshi Nishikawa
Effect of copper over-pad metallization on reliability of aluminum wire bonds   Microelectronics Reliability,99,(2019),168-176 Fumiyoshi Kawashiro
Kentaro Takao
Tatsuya Kobayashi
Masaaki Yoshikawa
Eitaro Miyake
Toshiki Endo
Tatsuo Tonedachi
Hiroshi Nishikawa
Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate   Microelectronics Reliability,99,(2019),62-73 Junghwan Bang
Dong-Yuri Yu
Yong-Ho Ko
Jun-Hyuk Son
Hiroshi Nishikawa
Chang-Woo Lee
Microstructure and mechanical properties of Sn-1.0Ag-0.5Cu solder with minor Zn additions   Journal of Materials Science: Materials in Electoronics,30,13(2019),11914-11922 Y. M. Leong
A. S. M. A. Haseeb
Hiroshi Nishikawa
Omid Mokhtari
Preferred Orientation of Bi and Effect of Sn-Bi Microstructure on Mechanical and Thermomechanical Properties in Eutectic Sn-Bi Alloy   Materialia,6,(2019),100309 Yu-An Shen
Shiqi Zhou
Sijie Huang
Hiroshi Nishikawa
The newly developed Sn-Bi-Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength   Materialia,6,(2019),100300 Shiqi Zhou
Chih-han Yang
Yu-An Shen
Shih-kang Lin
Hiroshi Nishikawa
Effects of In Content on the Microstructure and Mechanical Properties of In-Bi Alloys During Isothermal Aging   Metals,9,5(2019),548 Sanghun Jin
Omid Mokhtari
Shutetsu Kanayama
Hiroshi Nishikawa
Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation-Reduction Bonding with Copper Microparticles   Journal of Electronic Materials,48,4(2019),2263-2271 Runhua Gao
Siliang He
Yu-An Shen
Hiroshi Nishikawa
Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy   Journal of Materials Science: Materials in Electoronics,30,8(2019),7423-7434 Shiqi Zhou
Yu-An Shen
Tiffani Uresti
Vasanth C.Shunmugasamy
Bilal Mansoor
Hiroshi Nishikawa
Thermomigration Induced Microstructure and Property Changes in Sn-58Bi Solders   Materials & Design,166,(2019),107619 Yu-An Shen
Shiqi Zhou
Jiahui Li
K.N. Tu
Hiroshi Nishikawa
Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder   Scientific Reports,9,(2019),3658 Yu-An Shen
Chun-Ming Lin
Jiahui Li
Siliang He
Hiroshi Nishikawa
A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders   Materials,12,4(2019),631 Chih-han Yang
Shiqi Zhou
Shih-kang Lin
Hiroshi Nishikawa
Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy   Materials Science and Engineering: A,744,(2019),560-569 Shiqi Zhou
Chih-han Yang
Shih-kang Lin
Abdulaziz Nasser AlHazaa
Omid Mokhtari
Xiangdong Liu Hiroshi Nishikawa

Proceedings of International Conference

Title Research achievements summary Name
Effect of bonding temperature on shear strength of joints using micro-sized Ag particles for high temperature packaing technokigy Proc. of 22nd Microelectronics and Packaging Conference (EMPC),,(2019),MT-12-1-MT-12-4 Hiroshi Nishikawa
Myong-Hooh Roh
Akira Fujita
Nobuo Kamada
Tin Whisker Growth Mechanism on Tin Plating of MLCCs Mounted with Sn-3.5Ag-8In-0.5Bi Solder in 30℃60%RH Proc. of 22nd Microelectronics and Packaging Conference (EMPC),,(2019),R&Q-02-1-R&Q-02-4 Akira Saito
Hiroshi Nishikawa
Bonding strength of Cu/Cu joints using sintering process of micro-sized Cu particles for high-temperature application Proc. of IMAPS High Temperature Electronics Network (HiTEN 2019),,(2019),85-90 Hiroshi Nishikawa
Xiangdong Liu
Effects of In and Zn Double Addition on Eutectic Sn-58Bi Alloy Proceeding of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC),,(2019),1081-1086 Shiqi Zhou
Yu-An Shen
Hiroshi Nishikawa
Tiffani Uresti
Vasanth C. Shunmugasamy
Bilal Mansoor
Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints during Thermomigration Proceeding of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC),,(2019),2003-2008 Yu-An Shen
Shiqi Zhou
Jiahui Li
K. N. Tu
Hiroshi Nishikawa
A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere Proc. of 2019 International Conference of Electronics Packaging (ICEP) ,,(2019),159-162 Runhua Gao
Jiahui Li
Yu-An Shen
Hiroshi Nishikawa
Bonding strength of Cu-to-Cu joints using Cu cold spray deposition by an oxidation and reduction process for power device package Proc. of 2019 International Conference of Electronics Packaging (ICEP),,(2019),432-436 Juncai Hou
Chengxin Li
Sijie Huang
Hiroshi Nishikawa
Development of Sn-Bi-In-Ga quaternary low-temperature solders Proc. of 2019 International Conference of Electronics Packaging (ICEP),,(2019),367-369 Chih-han Yang
Shiqi Zhou
Shih-kang Lin
Hiroshi Nishikawa
The study of Sn-45Bi-2.6Zn alloy before and after thermal aging Proc. of 2019 International Conference of Electronics Packaging (ICEP),,(2019),333-336 Shiqi Zhou
Chih-han Yang
Yu-An Shen
Shih-kang Lin
Hiroshi Nishikawa

Book

Title Research achievements summary Name
Novel Structured Metallic and Inorganic Materials Springer,(2019),,191-202, 589-604 Hiroshi Nishikawa
 
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