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[Manufacturing Process] include Division

Journal Publication

Title Research achievements summary Name
Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O3 Treatment   Journal of Electronic Materials,47,10(2018),5952-5958 Weixin Fu
Tatsushi Kaneda
Akiko Okada
Kaori Matsunaga
Shuichi Shoji
Mikiko Saito
Hiroshi Nishikawa
Jun Mizuno
Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition   Metals,8,8(2018),586:1-586:11 Junghwan Bang
Dong-Yurl Yu
Ming Yang
Yong-Ho Ko
Jeong-Won Yoon
Hiroshi Nishikawa
Chang-Woo Lee
Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium   Journal of Alloys and Compounds,762,(2018),586-597 C.A. Yang
S. Yang
X. Liu
H. Nishikawa
C.R. Kao
Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging   Journal of Alloy and Compounds,765,(2018),1243-1252 Shiqi Zhou
Omid Mokhtari
Muhammad Ghufan Rafique
Vasanth C. Shunmugasamy
Bilal Mansoor
Hiroshi Nishikawa
Materials Merging Mechanism of Microfluidic Electroless Interconnection Process   Journal of The Electrochemical Society,165,7(2018),D273-D281 S. Yang
H. T. Hung
P. Y. Wu
Y. W. Wang
H. Nishikawa
C. R. Kao
Corrosion and leaching behaviours of Sn-0.7Cu-0.05Ni lead-free solder in 3.5 wt. % NaCl solution   International Journal of Corrosion,2018,(2018),ID6580750 Jan-Ervin Guerrero
Omid Mokhtari
Hiroshi Nishikawa
Drexel Camacho
Effect of surface potential distribution on corrosion behavior of SnAgCu solder/Cu substrate interface   Solid State Phenomena,273,(2018),77-82 Omid Mokhtari
Hiroshi Nishikawa
Microstructural characterization of Ni-based self-fluxing alloy after selective surface-engineering using diode laser   Applied Surface Science,442,(2018),726-735 Eun-Joon Chun
Changkyoo Park
Hiroshi Nishikawa
Min-Su Kim
Laser-assisted selective fusing of thermal sprayed Ni-based self-fluxing alloys by using high-power diode lasers   Optics and Laser Technology,100,(2018),317-324 Eun-Joon Chun
Min-Su Kim
Hiroshi Nishikawa
Changkyoo Park
Jeong Suh
Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging   Journal of Materials Science: Materials in Electronic,29,5(2018),3800-3807 Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Mutsuo Saito

Proceedings of International Conference

Title Research achievements summary Name
Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying Proc. of 7th Electronics System-Integration Technology Conference,,(2018),MAT1-1:1-MAT1-1:4 Mikiko Saito
Jun Mizuno
Shunichi Koga
Hiroshi Nishikawa
Interfacial Reaction of Sn-Ag-Cu-Ni Solder/Cu Joints by Laser Process Proc. of 7th Electronics System-Integration Technology Conference,,(2018),INTS2A-4:1-INTS2A-4:4 Hiroshi Nishikawa
Ryo Matsunobu
Textile-Integrated Stretchable Structures for Wearable Wireless Platforms Proc. of 7th Electronics System-Integration Technology Conference,,(2018),INTS3A-6:1-INTS3A-6:4 Han He
Xiaochen Chen
Omid Mokhtari
Hiroshi Nishikawa
Leena Ukkonen
Johanna Virkki
Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process Proc. of 2018 IEEE 68th Electronic Components and Technology Conference,,(2018),308-313 Sean Yang
Han-Tan Hung
Hiroshi Nishikawa
C. Robert Kao
High Reliability Sintered Silver-Indium Bonding with Anti-Oxidation Property for High Temperature Application Proc. of 2018 IEEE 70th Electronic Components and Technology Conference,,(2018),1993-1999 Chun An Yang
C. Robert Kao
Hiroshi Nishikawa
Chin C. Lee
Improvement of Mechanical Properties of Zn-Added Sn58Bi Alloy by Zn Segregation on the Sn-Bi Phase Boundaries During Thermal Aging Proc. of 2018 IEEE 69th Electronic Components and Technology Conference,,(2018),1899-1905 Shiqi Zhou
Omid Mokhtari
Hiroshi Nishikawa
Mechanical Properties of Sn-Bi-In-Ga Low Melting Temperature Solder Alloys Proc. of 2018 International Conference on Electronics Packaging and IMAPS ALL Asia Conference (ICEP-IAAAC 2018),,(2018),409-410 Chih-han Yang
Shiqi Zhou
Hiroshi Nishikawa
Shih-kang Lin

Award

Title Sponsor Name
67th ECTC Best Interactive Session Paper IEEE Electronics Packaging Society Hiroshi Nishikawa
 
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