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[Smart Green Processing] include Division

Journal Publication

Title Research achievements summary Name
Laser-assisted selective fusing of thermal sprayed Ni-based self-fluxing alloys by using high-power diode lasers   Optics and Laser Technology,100,(2018),317-324 Eun-Joon Chun
Min-Su Kim
Hiroshi Nishikawa
Changkyoo Park
Jeong Suh
Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint   Journal of Alloys and Compounds,728,(2017),992-1001 Junghwan Bang
Dong-Yurl Yu
Yong-Ho Ko
Min-Su Kim
Hiroshi Nishikawa
Chang-Woo Lee
Transmission electron microscopy investigation on the oxidation behavior of electroless Ni/immersion Au surface finish at 250 ℃   Journal of Nanoscience and Nanotechnology,17,11(2017),8522-8527 Min-Su Kim
Hiroshi Nishikawa
Influence of ENIG defects on shear strength of pressureless Ag nanoparticle sintered joint under isothermal aging   Microelectronics Reliability,76-77,(2017),420-425 Min-Su Kim
Hiroshi Nishikawa
Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250 ℃   Journal of Materials Science: Materials in Electronics,28,17(2017),12606-12616 Xiangdong Liu
Shiqi Zhou
Hiroshi Nishikawa
Effect of temperature and substrate on shear strength of the joints formed by sintering of micro-sized Ag particle paste without pressure   Journal of Materials Science: Materials in Electronics,28,10(2017),7292-7301 Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Mutsuo Saito
Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux   Journal of Alloys and Compounds,695,(2017),981-990 G.K. Sujan
A.S.M.A. Haseeb
Hiroshi Nishikawa
M.A. Amalin
Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach   Journal of Alloys and Compounds,695,(2017),2165-2172 Xiangdong Liu
Siliang He
Hiroshi Nishikawa

Proceedings of International Conference

Title Research achievements summary Name
Impact strength of Sn-Ag-Cu/Cu solder bumps formed by an induction heating method Proc. of the 12th International Microsystems, Packaging, Assembly and Circuits Technology,,(2017),159-162 Yujian Zhang
Siliang He
Hiroshi Nishikawa
Effect of bonding conding conditions on shear strength of joints at 200℃ using Sn-coated Cu Particle Proc. of The 18th International Coference on Electronic Pacaging Technology,,(2017),181:1-181:4 Hiroshi Nishikawa
Xiangdong Liu
Siliang He
The evaluation of mechanical properities of Sn58BiXTi solder by tensile test Proc. of The 18th International Coference on Electronic Pacaging Technology ,,(2017),703-707 Shiqi Zhou
Xiangdong Liu
Omid Mokhtari
Hiroshi Nishikawa
Effect of isothermal aging at 250 ℃ on shear strength of joints using Sn-Coated Cu particle paste for high-temperature application   Proceeding of IMPAS International Conference on High Temparature Electronics Network (HiTEN 2017),2017,HiTen(2017),202-206 Hiroshi Nishikawa
Xiangdong Liu
Siliang He
Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-silver Joint Proc. of the 67th Electronic Components and Technology Conference (ECTC2017),,(2017),1974-1980 Chun-An Yang
C. Robert Kao
Hiroshi Nishikawa
Effect of substrate metallization on the impact strength of Sn-Ag-Cu Solder bumps fabricated in a formaic acid atomosphere Proceedings of 2017 International Conference on Electronics Packaging(ICEP 2017),,(2017),381-385 Shiqi Zhou
Siliang He
Hiroshi Nishikawa

Lecture

Title Research achievements summary Name
New bonding process using maicroscale particles for die-attach in power devices 18th International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA 2017),Taipei, Taiwan,(2017.11.05-2017.11.09) Hiroshi Nishikawa
New process using localized heating method for lead-free solders The 15th international conference on QiR,Nusa Dua Bali, Indonesia,(2017.07.24-2017.07.27) Hiroshi Nishikawa
Yujian Zhang
Noriya Iwata
Novel soldering process using localized heating method for wearable devices International Welding/Joining Conference-Korea2017,GyeongJu, Korea,(2017.04.11-2017.04.14) Hiroshi Nishikawa
Pb-free bonding process for semiconductor power device The 10th Thailand International Metallurgy Conference (TIMETC-10),Bankok, Thailand,(2017.03.30-2017.03.31) Hiroshi Nishikawa
Formation and Growth of Intermetallic Compound Layer at the Lead-free Solder/Cu Interface Using Laser Soldering Process TMS 2017 146th Annual Meeting & Exhibition,California, USA,(2017.02.26-2017.03.02) Hiroshi Nishikawa
Noriya Iwata
Shinya Kubota

Award

Title Sponsor Name
Best Student Paper Award, 3rd Place Chinese Institute of Electronics, China Shiqi Zhou
Xiangdong Liu
Omid Mokhtari
Hiroshi Nishikawa
 
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