大阪大学接合科学研究所 スマートプロセス研究センタースマートグリーンプロセス学分野
(協力領域:工学研究科環境・エネルギー工学専攻 スマートグリーンプロセス学領域)

大阪大学接合科学研究所
スマートプロセス研究センター
スマートグリーンプロセス学分野
(協力領域:工学研究科環境・エネルギー工学専攻 スマートグリーンプロセス学領域)

研究業績・今後の予定

研究業績

雑誌掲載論文

表 題 研究業績概要 氏 名
Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux  doi Journal of Alloys and Compounds,695,(2017),981-990 G.K. Sujan
A.S.M.A. Haseeb
Hiroshi Nishikawa
M.A. Amalin
Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach  doi Journal of Alloys and Compounds,695,(2017),2165-2172 Xiangdong Liu
Siliang He
Hiroshi Nishikawa
Effect of Bonding Temperature on the Joining of Ti-6Al-4V Alloy Using Cu Coatings and Sn Interlayers  doi Journal of Materials Engineering and Performance,26,1(2017),407-417 Abdulaziz N. Alhazaa
Sultan H. Algharbi
Hiroshi Nishikawa
Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu substrate  doi Materials Transactions,57,8(2016),1272-1276 Omid Mokhtari
Shiqi Zhou
Y.C. Chan
Hiroshi Nishikawa
Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging  doi Scripta Materialia,120,(2016),80-84 Xiangdong Liu
Hiroshi Nishikawa
Interfacial Reaction between Sn-Ag-Cu-Mg solder and ENIG substrate Key Engineering Materials,706,(2016),2016-2019 Hiroshi Nishikawa
Abdulaziz N. Alhazaa
Siliang He
Abdulhakim A. Almajid
Mahmoud S. Soliman
Reliability of Ag nanoporous bonding joint for high temperature die attach under temperature cycling  doi Materials Transactions,57,7(2016),1192-1196 Min-Su Kim
Kaori Matsunaga
Yong-Ho Ko
Chang-Woo Lee
Hiroshi Nishikawa
Pressureless bonding by micro-sized silver particle paste for high-temperature electronic packaging  doi Materials Transactions,57,7(2016),1209-1214 Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Mutsuo Saito
The shear strength of transient liquid phase bonded Sn-Bi solder joint with added Cu particles  doi Advanced Powder Technology,27,(2016),1000-1005 Omid Mokhtari
Hiroshi Nishikawa
Transient liquid phase bonding of Sn-Bi solder with added Cu particles  doi Journal of Materials Science: Materials in Electronics,27,5(2016),4232-4244 Omid Mokhtari
Hiroshi Nishikawa
Effect of magnetic flux density on Sn crystallographic orientation in a solder joint system  doi Journal of Materials Science: Materials in Electronics,27,4(2016),3710-3714 Kimihiro Yamanaka
Hiroshi Nishikawa
Hirohisa Taguchi
Miyuki Harada
Koichi Ochi

国際会議発表論文

表 題 研究業績概要 氏 名
Bonding Process Using Microscale Ag Particle Paste for Die Attach Proc. of 6th Electronics System-Integration Technology Conference,,(2016),sp4p8:1-sp4p8:4 Hiroshi Nishikawa
Xiandong Liu
Xianfan Wang
Akira Fujita
Nobuo Kamada
Mitsuo Saito
Improved Joint Strength with Sintering Bonding Using Microscale Cu particles by an Oxidation-reduction Process Proc. of 2016 IEEE 66th Electronic Components and Technology Conference,,(2016),455-460 Xiangdong Liu
Hiroshi Nishikawa
Effect of Isothermal Aging at 250 ℃ on Shear Strength of Joints Using Au Nanoporous Nonding for Die Attach Proc. of IMAPS International Conference and Exhibition on High Temperature Electronics (HiTEC2016),,(2016),143-147 Hiroshi Nishikawa
Kaori Matsunaga
Min-Su Kim
Mikiko Saito
Jun Mizuno
Bonding Process without Pressure using a Chestnut-burr-like Particle Paste for Power Electronics Proc. of 2016 International Conference on Electronics Packaging,,(2016),391-394 Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiko Katsuya
Nobuo Kamada
Mitsuo Saito
Investigation of Connecting Techniques for High Temperature Application on Power Modules Proc. of 2016 International Conference on Electronics Packaging,,(2016),378-381 Fumiyoshi Kawashiro
Yoshiki Endo
Tatsuo Tonedachi
Hiroshi Nishikawa
Low Temperature Bonding using Microscale Cu Particles Coated with Thin Sn Layers at 200 ℃ Proc. of 2016 International Conference on Electronics Packaging,,(2016),306-309 Xiangdong Liu
Siliang He
Hiroshi Nishikawa

国内会議発表論文

表 題 研究業績概要 氏 名
ギ酸雰囲気を用いた無電解Ni/Auめっき上へのはんだバンプ形成 第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,23,(2017),77-78 何 思慮
西川 宏
レーザはんだ付したNi添加はんだ/基板界面に及ぼすAuめっき処理の影響 第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集,23,(2017),463-464 松延 諒
西川 宏

国際会議発表,国内学会発表

表 題 研究業績概要 氏 名
Bonding process using a nanoporous gold sheet for high temperature electronics International Symposium on Micro-Nano Sience and Technology 2016,Tokyo, Japan,(2016.12.16-2016.12.18), Hiroshi Nishikawa
Kaori Matsunaga
Min-su Kim
Mikiko Saito
Jun Mizuno
TEM investigation on the oxidation behavior of electroless Ni/immersion Au surface finish at 250℃ International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE2016),Jeju, Korea,(2016.11.06-2016.11.09), Min-Su Kim
Hiroshi Nishikawa
Fracture behavior of low-pressure assisted Cu to Cu joint using micro-sized Ag particle paste for Power device packaging The 15th International Symposium on Microelectronics and Packaging (ISMP2016),Seoul, Korea,(2016.10.24-2016.10.26),51 Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiko Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Matsuo Saito
Effect of Aging Time on the Formation of IMC Layer as well as Voids in the Sn-Ag-Cu-Ni/Cu Substrate Interface in Laser Soldering The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016),Osaka, Japan,(2016.10.17-2016.10.18),143-144 Ryo Matsunobu
Hiroshi Nishikawa
Effect of Solder Paste Addition on Shear Strength using Micro-sized Silver Particle Paste without Pressure for Power Device Packaging The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016),Osaka, Japan,(2016.10.17-2016.10.18),23-24 Myong-Hoon Roh
Min-su KIM
Hiroshi Nishikawa
Effect of Thermal Aging on the Impact Strength of Soldered Bumps under Formic Acid Atmosphere The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016),Osaka, Japan,(2016.10.17-2016.10.18),27-28 Siliang He
Hiroshi Nishikawa
Microstructural Characteristics of Al-Ag Precursor for Fabricating Nanoporous Ag and its Dealloying Behavior in HCl Solution The 1st International Symposium on Creation of Life Innovation Materials for Interdisciplinary and International Researcher Development (iLIM-1),Osaka, Japan,(2016.10.17-2016.10.18),23-24 Min-su KIM
Hiroshi Nishikawa
Intermetallic compound formation at the interface between Sn-Bi solder and Cu by laser soldering 3rd International Conference on Nanojoining and Microjoining (NMJ 2016),Ontario, Canada,(2016.09.25-2016.09.28),39-40 Hiroshi Nishikawa
Shinya Kubota
Low-Pressure and Low-Temperature Bonding using Micro-Sized Ag Paste for Power Electronic Devices 3rd International Conference on Nanojoining and Microjoining (NMJ 2016),Ontario, Canada,(2016.09.25-2016.09.28),61-62 Myong-Hoon Roh
Hiroshi Nishikawa
Seiichiro Tsutsumi
Naruhiho Nishiwaki
Keiichi Ito
Koji Ishikawa
Akihiro Katsuya
Nobuo Kamada
Mutsuo Saito
High temperature die attach without organic materials using Ag nanoporous material The 21th International High Technologies Enviroment Safety & Health (IHTESH2016),Kobe, Japan,(2016.05.31-2016.06.02), Min-Su Kim
Hiroshi Nishikawa
ギ酸雰囲気を用いたはんだ付でのボイド形成に及ぼす加熱条件の影響 (一社)溶接学会 平成28年度春季全国大会,大阪,(2016.04.12-2016.04.14),158-159 何 思亮
西川 宏

講演

表 題 研究業績概要 氏 名
Intermetallic Compound Formation and Mechanical Property of Sn-Cu-xCr/Cu Lead-free Solder Joint The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016),Osaka, Japan,(2016.10.17-2016.10.18) Jung-Hwan BANG
Dong-Yuri YU
Yong-Ho KO
Hiroshi NISHIKAWA
Chang-Woo LEE 
Pb-free bonding process for electronics packaging The 21th International High Technologies Enviroment Safety & Health (IHTESH2016),Kobe, Japan,(2016.05.31-2016.06.02) Hiroshi Nishikawa

今後の学会発表等の予定

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