鉛フリーはんだとその関連規格リスト

　

 IEC  試験方法規格(材料規格を含む）  備考
IEC 61190-1-1 (2002-03) Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly 鉛フリーはんだ対応はFDIS段階
IEC 61190-1-2 (2002-03) Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly 鉛フリーはんだ対応はFDIS段階
IEC 61190-1-3 (2002-03) Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications 鉛フリーはんだ対応はFDIS段階
 IEC  試験方法規格  備考
IEC 60068-2-20 (1979-01) Environmental testing. Part 2: Tests. Test T: Soldering
IEC 60068-2-20-am2 (1987-01) Amendment 2 - Environmental testing. Part 2: Tests. Test T: Soldering
IEC 60068-2-44 (1995-01) Environmental testing - Part 2: Tests - Guidance on test T: Soldering
IEC 60068-2-54 (1985-01) Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method
IEC 60068-2-58 (2005-02) Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-69 (1995-12) Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
IEC 61190-1-1 (2002-03) Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly 鉛フリーはんだ対応はFDIS段階
IEC 61190-1-2 (2002-03) Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly 鉛フリーはんだ対応はFDIS段階
IEC 61190-1-3 (2002-03) Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications 鉛フリーはんだ対応はFDIS段階
IEC 61191-1 (1998-08) Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-2 (1998-08) Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-3 (1998-08) Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 61191-4 (1998-08) Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
IEC 61192-1 (2003-02) Workmanship requirements for soldered electronic assemblies - Part 1: General
IEC 61192-2 (2003-03) Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
IEC 61192-3 (2002-12) Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
IEC 61192-4 (2002-11) Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
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