Publications (2011, 2010)
Refereed Papers
Authors Title Journals
2011
Li-Ngee HO, H. Nishikawa, and T. Takemoto Effect of different copper fillers on the electrical resistivity of conductive adhesives J. Mater. Sci.,: Mater. Electron., Vol. 22(2011), No.5, pp.538-544.
Li-Ngee HO, T-F. Wu, H. Nishikawa, T. Takemoto and Koichi Miyake, Masakazu Fujita, Koyu Ota Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives J. Mater. Sci.,: Mater. Electron., Vol. 22(2011), No. 7, 735-740.
Toru Nagaoka, Yoshiaki Morisada, Masao Fukusumi, Tadashi Takemoto Selection of soldering temperature for ultrasonic-assisted soldering of 5056 aluminum alloy using Zn-Al system solders Journal of Materials Processing Technology, Vol. 211(2011). No. 9, 1534-1539.

2010
Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa and Tadashi Takemoto High-Temperature Resistant Intermetallic Compound Joints for Si Chips and Cu Substrates

J. Electronic Mat., Vol. 39(2010), No. 10, pp. 2274-2280.

H. Nishikawa, S. Mikami, K. Miyake, A. Aoki and T. Takemoto

Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

Materials Transactions, Vol. 51(2010), No.10, pp.1785-1789.

西川　宏，Feng Gao，小松　朗，竹本　正 Co添加鉛フリーはんだ/Cu界面金属間化合物の形態と機械的特性 銅及び銅合金, Vol. 49(2010), No.1, pp.121-124.
Li-Ngee HO, T-F. Wu, H. Nishikawa, and T. Takemoto Electrical Properties of Pre-Alloyed Cu-P Containing Electrically Conductive Adhesive The Journal of Adhesion, Vol. 86(2010), No. 8, pp.807-815.
Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa, Tadashi Takemoto Improvement of High-Temperature Performance of Zn-Sn Solder Joint J. Electronic Mat., Vol. 39(2010), No.8, pp.1241-1247.
H. Nishikawa, K. WongPiromsarn, H. Abe, T. Takemoto, M. Kubo, Y. Sanagawa, T. Sakai, M. Fukuhara and A. Inoue Low temperature bonding of bulk metallic glass using an ultrasonic process Ceramic Trans., Vol. 219(2010), pp.29-35.
HO. L. Ngee,  Hiroshi Nishikawa, Naohide Natsume, Tadashi Takemoto, Koichi Miyake, Masakazu Fujita and Koyu Ota Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives J. Electronic Materials, Vol.39(2010), No.1, pp.115-123.
Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa, Tadashi Takemoto Thin film joining for high-temperature performance of power semi-conductor devices Microelectronics Reliability, Vol. 50(2010), No. 2, pp.220-227.
International Conference
Authors Title Journals
2011
H. Watanabe, M. Nagai, T. Osawa and I. Shohji Effect of Ni Content on Dissolution Properties of in Molten Sn-Ag-Cu-Ni-Ge Alloy Key Engineering Materials Vols.462-463, (2011)，70-75.
H. Watanabe, M. Shimoda, N. Hidaka and I. Shohji Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition Key Engineering Materials Vols.462-463, (2011)，247-252.
2010
T. Daito, H. Nishikawa, T. Takemoto, T. Matsunami Impact Test of Sn-3.0Ag-0.5Cu (-xCo) Solder with Co-P Plating Proc. International Conference on Electronics Packaging 2010 (ICEP 2010), (2010), pp.796-799.
T. Naoi, H. Nishikawa, T. Takemoto, H. Abe, M. Fukuhra and A. Inoue Enhancement of Solderability of Cu60Zr30Ti10 Bulk Metallic Glass by Dealloying in Hydrofluoric Acid Solution Visual-JW2010, Osaka, Japan (2010.11.11-12), 310-311.
H. Watanabe, M. Shimoda, N. Hidaka and I. Shohji Effect of Ni and Ag on Interfacial Reaction and Microstructure of Sn-Ag-Cu-Ni-Ge Solder Alloy Proc. 8th Int. Conf. on Fracture and Strength of Solids, Kuala Lumpur, Malaysia (2010.6.7-9), Paper ID A064.
H. Watanabe, M. Nagai, T. Osawa and I. Shohji Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Proc. 8th Int. Conf. on Fracture and Strength of Solids, Kuala Lumpur, Malaysia (2010.6.7-9), Paper ID A022.
Domestic Conference
Authors Title Journals
2011

岩田　典也，西川　宏，竹本　正

N. IWATA, H. NISHIKAWA and T. TAKEMOTO

レーザはんだ付されたSn-3.0Ag-0.5Cuはんだ継手の接合性評価

Evaluation of Bondability on Sn-3Ag-0.5Cu Solder Joints by Laser Soldering

第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.17(2011), pp.299-302.

17th Symp. on “Microjoining and Assembly Technology in Electronics”, Vol. 17 (2011),      pp. 95-98 (in Japanese).

平野　智章，西川　宏，竹本　正

T. HIRANO, H. NISHIKAWA, T. TAKEMOTO and N. TERADA

Cuナノ粒子継手の接合性に及ぼす雰囲気の影響

Effects of Joining Atmosphere on Bondability of Joints Using Cu Nanoparticle Paste

第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.17(2011), pp.95-98.

17th Symp. on “Microjoining and Assembly Technology in Electronics”, Vol. 17 (2011),      pp. 299-302 (in Japanese).
2010
西川　宏，Ho Li-Ngee，竹本　正，柏木行康，山本真理，中許昌美 銅ナノ粒子含有導電性接着剤の特性に及ぼす有機層の影響 第16回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.16(2010), pp.115-118.
高橋　利英，末永　誠一，小松　周一，西川　宏，竹本　正 薄膜接合による耐高温鉛フリー接合部の継手特性 第16回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集, Vol.16(2010), pp.171-176.
Trans. JWRI
Authors Title Journals
2011
K. Yasuda, Y. Sakino, I. Shoji and T. Takemoto Dynamic Mechanical Behavior of Sn-Ag-Cu Lead-Free Solders by Tensile Test under High Strain Rate Trans. JWRI, Vol. 39,  (2011) , No. 2,
T. Naoi, H. Nishikawa, T. Takemoto, H. Abe, M. Fukuhra and A. Inoue Enhancement of Solderability of Cu60Zr30Ti10 Bulk Metallic Glass by Dealloying in Hydrofluoric Acid Solution Trans. JWRI, Vol. 39, (2011), No. 2,
T. Daito, H. Nishikawa, T. Takemoto and T. Matsunami Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder/Co-P Plating and Ni-Co-P Plating Trans. JWRI, Vol. 39, (2011) , No. 2,

Others

Authors Title Journals

2011

竹本　正

TAKEMOTO Tadashi

はんだ・はんだ付関連規格の動向

Trends of standards related with solder and soldering 

溶接技術, 59(2011), No. 12, 73-77. (in Japanese)

竹本　正

TAKEMOTO Tadashi

最近の鉛フリーはんだ事情

Situation of Recent Lead-free Solders 

 ぶれいず, 45(2011), No. 116, 17-23. (in Japanese)

竹本　正

TAKEMOTO Tadashi

18章 エレクトロニクスにおけるレアメタル　　 はんだ

Rare Metals used in Electronics, Solder

レアメタル便覧 III巻, 丸善, (2011), 1月
Rare Metal Handbook, Vol. III, MARUZEN, (2011), January

Tadashi Takemoto

DISSOLUTION OF PRECIOUS METALS FROM WASTE PRINTED CIRCUIT BOARDS BY USING BACTERIA

Handbook of Metal Biotechnology -Applications for Environmental Conservation and Sustainability-, Ed. by M. Ike, Pan Stanford Publishing, (2011), March

2010

竹本　正

TAKEMOTO Tadashi

随筆: 大阪大学接合科学研究所での研究生活３５年

Essay: Research Works for 35 years in Joining and Welding research Institute, Osaka University

溶接学会誌, Vol. 79(2010), No. 7, 629-632.

J. Japan Weld. Soc., Vol. 79(2010), No. 7, 629-632.

　

研　究　業　績
職位 氏名 (Name)

研究論文等

 その他
特任教授 竹本　 正   (Tadashi TAKEMOTO)
准教授（兼任） 西川　宏 (Hiroshi NISHIKAWA)
特任助教 下田　将義 (Masayoshi SHIMODA)   特許出願16件
特任助教 山川　智弘 (Tomoiro YAMAKAWA )

　
　
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