研究業績・今後の予定
研究業績
雑誌掲載論文
| 表 題 | 研究業績概要 | 氏 名 |
|---|---|---|
Transmission electron microscopy investigation on the oxidation behavior of electroless Ni/immersion Au surface finish at 250 ℃  |
Journal of Nanoscience and Nanotechnology,17,(2017),8522-8527 | Xiangdong Liu Hiroshi Nishikawa |
| Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250 ºC |
Journal of Materials Science: Materials in Electronics,28,(2017),12606-12616 | Xiangdong Liu Shiqi Zhou Hiroshi Nishikawa |
| Effect of temperature and substrate on shear strength of the joints formed by sintering of micro-sized Ag particle paste without pressure |
Journal of Materials Science: Materials in Electronics,28,(2017),7292-7301 | Myong-Hoon Roh Hiroshi Nishikawa Seiichiro Tsutsumi Naruhiko Nishiwaki Keiichi Ito Koji Ishikawa Akihiro Katsuya Nobuo Kamada Mutsuo Saito |
| Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation-reduction process |
Journal of Materials Science: Materials in Electronics,28,(2017),5554-5561 | Xiangdong Liu Hiroshi Nishikawa |
| Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux |
Journal of Alloys and Compounds,695,(2017),981-990 | G.K. Sujan A.S.M.A. Haseeb Hiroshi Nishikawa M.A. Amalin |
| Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach |
Journal of Alloys and Compounds,695,(2017),2165-2172 | Xiangdong Liu Siliang He Hiroshi Nishikawa |
| Effect of Bonding Temperature on the Joining of Ti-6Al-4V Alloy Using Cu Coatings and Sn Interlayers |
Journal of Materials Engineering and Performance,26,1(2017),407-417 | Abdulaziz N. Alhazaa Sultan H. Algharbi Hiroshi Nishikawa |
| Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu substrate |
Materials Transactions,57,8(2016),1272-1276 | Omid Mokhtari Shiqi Zhou Y.C. Chan Hiroshi Nishikawa |
| Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging |
Scripta Materialia,120,(2016),80-84 | Xiangdong Liu Hiroshi Nishikawa |
| Interfacial Reaction between Sn-Ag-Cu-Mg solder and ENIG substrate | Key Engineering Materials,706,(2016),2016-2019 | Hiroshi Nishikawa Abdulaziz N. Alhazaa Siliang He Abdulhakim A. Almajid Mahmoud S. Soliman |
| Reliability of Ag nanoporous bonding joint for high temperature die attach under temperature cycling |
Materials Transactions,57,7(2016),1192-1196 | Min-Su Kim Kaori Matsunaga Yong-Ho Ko Chang-Woo Lee Hiroshi Nishikawa |
| Pressureless bonding by micro-sized silver particle paste for high-temperature electronic packaging |
Materials Transactions,57,7(2016),1209-1214 | Myong-Hoon Roh Hiroshi Nishikawa Seiichiro Tsutsumi Naruhiko Nishiwaki Keiichi Ito Koji Ishikawa Akihiro Katsuya Nobuo Kamada Mutsuo Saito |
| The shear strength of transient liquid phase bonded Sn-Bi solder joint with added Cu particles |
Advanced Powder Technology,27,(2016),1000-1005 | Omid Mokhtari Hiroshi Nishikawa |
| Transient liquid phase bonding of Sn-Bi solder with added Cu particles |
Journal of Materials Science: Materials in Electronics,27,5(2016),4232-4244 | Omid Mokhtari Hiroshi Nishikawa |
| Effect of magnetic flux density on Sn crystallographic orientation in a solder joint system |
Journal of Materials Science: Materials in Electronics,27,4(2016),3710-3714 | Kimihiro Yamanaka Hiroshi Nishikawa Hirohisa Taguchi Miyuki Harada Koichi Ochi |
講演
| 表 題 | 研究業績概要 | 氏 名 |
|---|---|---|
| Intermetallic Compound Formation and Mechanical Property of Sn-Cu-xCr/Cu Lead-free Solder Joint | The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016),Osaka, Japan,(2016.10.17-2016.10.18) | Jung-Hwan BANG Dong-Yuri YU Yong-Ho KO Hiroshi NISHIKAWA Chang-Woo LEE |
| Pb-free bonding process for electronics packaging | The 21th International High Technologies Enviroment Safety & Health (IHTESH2016),Kobe, Japan,(2016.05.31-2016.06.02) | Hiroshi Nishikawa |
